Microelectronic Technologies and Packaging


Main research areas

  • Circuit miniaturization (including lead-free soldering)
  • Semiconductor chip contacting and packaging
  • Eco-friendly PCB cleaning
  • Multi-layer structures with nested passive components

Main practical research results

  • Glass substrates to trace the activity of PBC cleaning agents
  • A directly heated template for re-creating spherical solder outlets in BGA packaging
  • High-resolution dispensing printing equipment
  • A soldering station to operate at reduced pressures in a protective atmosphere

Projects/Industrial contracts